This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed.
Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging.
Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. The results of these studies have been reported rather sporadically at various technical conferences. This is the first book dedicated specifically to this topic, which is of paramount importance to the electronics industry. The coverage is focused primarily on tin-silver-copper and tin-copper eutectic (or near eutectic) alloys—the primary lead-free solder alloys being adopted by the worldwide electronics industry.
This volume will be of particular interest to practitioners in the electronics industry, who need to understand the reliability of solder interconnects for design, testing, quality assurance, and failure analysis. It also will be of great value to industry and academic researchers, educators, and students.
Preface
Chapter 1 : Lead-Free Soldering and Environmental Compliance : An Overview
Chapter 2 : Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects
Chapter 3 : Fatigue and Creep of Lead-Free Solder Alloys : Fundamental Properties
Chapter 4 : Lead-Free Solder Joint Reliability Trends
Chapter 5 : Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects
Chapter 6 : Tin Whisker Growth on Lead-Free Solder Finishes
Chapter 7 : Accelerated Testing Methodology for Lead-Free Solder Interconnects
Chapter 8 : Thermomechanical Reliability Prediction for Lead-Free Solder Interconnects
Chapter 9 : Design for Reliability : Finite-Element Modeling of Lead-Free Solder Interconnects
Chapter 10 : Characterization and Failure Analyses of Lead-Free Solder Defects
Chapter 11 : Reliability of Interconnects with Conductive Adhesives
Index
