Tab Article

Introduction

Part I : Reliability Design Methodologies
Chapter 1 : Vehicle Electrical/Electronic System Design Considerations
Chapter 2 : TTP Two Level Design Approach : Tool Support for Composable Fault-Tolerant Real-Time Systems
Chapter 3 : TTP/C - Multiplexed Communications for Fault-Tolerant Automotive Systems
Chapter 4 : The X-By-Wire Concept : Time-Triggered Information Exchange and Fail Silence Support by New System Services
Chapter 5 : Information Technology Restructures Car Electronics
Chapter 6 : Effectiveness of a Robust Control Method for Automotive Powertrain Control
Chapter 7 : System Safety in Computer-Controlled Automotive Systems
Chapter 8 : Systems and Software : The Changing Paradigm in Automotive Electronics
Chapter 9 : A New Method for Reliability Centered Maintenance Improvement
Chapter 10 : Active Vibration Control
Chapter 11 : A Reliability Engineering Process in a Simultaneous Engineering
Chapter 12 : Concept and Concurrent Analysis and Optimization in a Product Design and Development Process

Part II : EMC, EMI, and ESD Considerations in Design
Chapter 13 : How to Quality EMC in Multiplexing
Chapter 14 : Automotive Electromagnetic Compatibility (EMC)
Chapter 15 : EF Falcon Electromagnetic Compatibility Testing
Chapter 16 : Motor Vehicle Safety and the Electromagnetic Environment : A Review of Their Relationships and Consderations
Chapter 17 : Design for Electromagnetic Compatibility and Vehicle Safety
Chapter 18 : Multilayer Varistors in Automobile MUX Bus Applications
Chapter 19 : EMC Susceptibility Testing of a CAN Car
Chapter 20 : Designing with Microcontrollers with Low EMI
Chapter 21 : Influence of Electromagnetic Fields Radiated by Lightning Discharges on Automotive Electronic Components

Part III : Examples of Reliable Product Designs
Chapter 22 : Integrated Motor Drive Unit : A Mechatronics Packaging Concept for Automotive Electronics
Chapter 23 : Delphi Secured Microcontroller Architecture
Chapter 24 : OSEKtime : A Dependable Real-Time Fault-Tolerant Operating System and Communication Layer as an Enabling Technology for By-Wire Applications
Chapter 25 : Approach to "System on Chip" of ABS/ECU - Using Mixed Signal ASIC and Method of Construction
Chapter 26 : High Pincount Packages under Automotive Conditions
Chapter 27 : Ignition System Integrated AC Ion Current Sensing for Robust and Reliable Online Engine Control
Chapter 28 : The Role of Power Electronics in Future Automotive Systems
Chapter 29 : Future Breakdown-Voltage and High Linearity Camel-Gate Field-Effect Transistor with Multiple Modulation-Doped Channels
Chapter 30 : A High-Breakdown and Low-Offset Voltage InGaP/GaAs Heterostructure Bipolar Transistor for Power System Applications
Chapter 31 : Smart Power Supply Concept for 32-Bit Microcontroller Applications
Chapter 32 : Realizing Distributed Engine Control Subsystems Through Application of High Temperature Intelligent Engine Sensors and Control Electronics
Chapter 33 : Integration of Liquid Cooling Thermal and Thermomechanical Design for the Lifetime Prediction of Electrical Power Modules
Chapter 34 : PBGA Reliability Study for Automotive Applications
Chapter 35 : High Power Surface Mount Packages
Chapter 36 : Advanced Semiconductor Developments for Automotive Systems
Chapter 37 : LED Lamp Reliability : Design and Production Process Impact
Chapter 38 : Development of Robust Motor Servo Control for Rear Steering Actuator Based on Two-Degree-of-Freedom Control System
Chapter 39 : Are MCMs the Answer?

Part IV : Reliability Test Procedures
Chapter 40 : Reliability Prediction of Fault Tolerant Automotive Systems
Chapter 41 : The Strategy of Accelerated Reliability Testing Development for Car Components
Chapter 42 : Post-Warranty Distribution : A New Approach to Modeling the Reliability of Products with Built-In Obsolescence
Chapter 43 : The Use of Physics-of-Failure Analysis to Predict the Reliability of Semiconductor Devices
Chapter 44 : Multiple Environment Accelerated Reliability Test Development
Chapter 45 : Turbocharger's Failure Mode Criticality Analysis Using Fuzzy Logic
Chapter 46 : Integration of Simulation and Testing for Microelectronics Package Reliability Improvement
Chapter 47 : Failure Mode & Effects Analysis in Software Development
Chapter 48 : Generic FMEA for Stand-Alone CAN Devices
Chapter 49 : Restoring the Effectiveness of Failure Modes and Effect Analysis
Chapter 50 : FMEA and the QS-9000 Requirement
Chapter 51 : Objective Detection Ranking Guidelines for Performing Process Failure Mode and Effects Analysis
Chapter 52 : Structured FMEA : A New Proposal for Failure Mode and Effect Analysis
Chapter 53 : Practical Issues Relating to Component Life Modelling within Rolls-Royce
Chapter 54 : Integrity of Automotive Electronic Systems : A View from Europe
Chapter 55 : The F.T.A as Designing Tools for Diagnostic, Performances and Reliability Prediction of Automotive Electronics Systems
Chapter 56 : Fault Tree Analysis F.T.A. - Recent Developments in Automotive Design by Means Software Package ISPRA-FTA
Chapter 57 : A Unified Approach to Solder Joint Life Prediction
Chapter 58 : Lessons Learnt in Testing High-Reliability Automotive Software
Chapter 59 : Correction Factors for Use with the Method of "Sudden Death" Weibull Analysis
Chapter 60 : Weibull Analysis with Assumed Weibull Slope Where NO Failures Are Observed
Chapter 61 : Reliability of Electronic Control Units in Motor Vehicles
Chapter 62 : Thermal Fatigue Analysis of PBGA Packages in Automotive Environment

Part V : Future Outlook
Chapter 63 : Electronics Reliability in 21st Century Vehicles