Computer Integrated Electronics Manufacturing and Testing

Title: Computer Integrated Electronics Manufacturing and Testing
Author: Jack Arabian
ISBN: 0824778499 / 9780824778491
Format: Hard Cover
Pages: 610
Publisher: Marcel Dekker
Year: 1989
Availability: In Stock

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This informative book describes the computer integrated manufacturing and testing process as it relates to the electronics industry-focussing on such important areas as printed wiring boards, networking, automatic assembly, surface mount technology, tape automated bonding, bar coding, and electro-static discharge.
Treating both basic and advanced topics, Computer Integrated Electronics Manufacturing and Testing covers specialized manufacturing processes...examines the life cycle of a product, from concept and design to manufacturing and testing through maintenance and field service....studies the effects of group work ethics as a factor in the success equation....considers the importance of product quality...discusses Computer Integrated Manufacturing...explores Artificial Intelligence and its relation to manufacturing....contains end-of-chapter references, charts, over 100 photographs, and detailed appendixes that list definitions, abbreviations, and industry buzz...words...plus more.
Timely, comprehensive, and highly practical, the volume is an ideal resource for all engineers involved in computer integrated electronics manufacturing and testing.

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Preface
Acknowledgements
Introduction

Chapter 1 : The Printed Wiring Board (PWB) in Electronics Manufacturing
Chapter 2 : Solder and Automated Soldering Processes
Chapter 3 : Automated Assembly Techniques
Chapter 4 : ESD (Electrostatic Discharge)
Chapter 5 : Bar Coding and Other Marking Systems
Chapter 6 : Manufacturing Test
Chapter 7 : Computer-Assisted Repair
Chapter 8 : Networking for Electronics Manufacturing
Chapter 9 : Surface Mount Technology (SMT) and Tape Automated Bonding (TAB)
Chapter 10 : Artificial Intelligence and Expert Systems in Manufacturing
Chapter 11 : KAISHA and Electronics Manufacturing
Chapter 12 : Waves of Opportunity

Appendix A : Contamination Problems of PWBS During Manufacturing and Test
Appendix B : Intermetallic Formation in Solder Processing
Appendix C : Background on Screen Printing : Thick-Film Circuits
Appendix D : List of Abbreviations
Appendix E : List of Definitions
Index