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3D integration of microsystems and subsystems has become imperative to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity.
This book tackles all aspects of 3D integration, including 3D circuit and system design, new process development, application of novel materials, and thermal challenges for restricting power dissipation. Presenting a coherent approach that takes into account distinct yet interrelated issues, the text discusses the use of interposer technology and the role of through-silicon vias (TSVs), as well as revisits traditional cooling techniques in view of the vertical interconnection of stacked subsystems.
