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This volume serves as a comprehensive guide to copper plating technology. The contents have been written by a team of experts who
cover all aspects of copper plating processes, including deposition and process details, process control, quality assurance, the properties of the deposited copper, and the effects of deposition parameters on properties. The volume also covers related technologies such as electroforming, patination (coloring) of copper, and the use of copper in electronics (for printed wiring boards and integrated circuits) and in the automotive industry. Includes a database with some 8000 abstracts covering all aspects of the surface treatment of copper and its alloys.
