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Characterization of Integrated Circuit Packaging Materials

Title: Characterization of Integrated Circuit Packaging Materials
Author: Robert McKenna, Thomas Moore
ISBN: 1606501879 / 9781606501870
Format: Hard Cover
Pages: 274
Publisher: Momentum Press
Year: 2010
Availability: Out of Stock

Tab Article

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems.

Readers will find:

  • General overview of IC package reliability testing
  • Characterization for the electrical performance of IC packages
  • Understanding surface characteristics and interfaces for thermal management
  • Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more

Tab Article

Foreword
Preface to the Reissue of the Materials Characterization Series
Preface to Series
Preface to the Reissue of Integrated Circuit Packaging Materials
Preface
Contributors

Chapter 1 : IC Package Reliability Testing
Chapter 2 : Mold Compound Adhesion and Strength
Chapter 3 : Mechanical Stress in IC Packages
Chapter 4 : Moisture Sensitivity and Delamination
Chapter 5 : Thermal Management
Chapter 6 : Electrical Performance of IC Packages
Chapter 7 : Solderability of Integrated Circuits
Chapter 8 : Hermeticity and Joining in Ceramic IC Packages
Chapter 9 : Advanced Interconnect Technology

Appendix Technique Summaries
1 : Acoustic Microscopy (C-AM)
2 : Atomic Absorption Spectrometry (AAS)
3 : Auger Electron Spectroscopy (AES)
4 : Ceramic Plate Test (CPT) for Evaluating Solderability of IC Devices
5 : Coulometric Method for Solderability Evaluation
6 : Decapsulation Techniques
7 : Differential Scanning Calorimetry (DSC)
8 : Dynamic Mechanical Analysis
9 : Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)
10 : Electron Probe X-Ray Microanalysis (EPMA)
11 : Energy-Dispersive X-Ray Spectroscopy (EDS)
12 : Finite Element Analysis (FEA)
13 : Fourier Transform Infrared Spectroscopy (FTIR)
14 : Inductively Coupled Plasma Mass Spectrometry (ICPMS)
15 : Inductively Coupled Plasma-Optical Emission Spectroscopy (ICP-OES)
16 : In Situ Strain Gauges
17 : Ion Chromatography
18 : Mechanical Testing in IC Packaging
19 : Scanning Electron Microscopy (SEM)
20 : Scanning Tunneling Microscopy (STM) and Scanning Force Microscopy (SFM)
21 : Static Secondary Ion Mass Spectrometry (Static SIMS)
22 : Thermogravimetric Analysis (TGA)
23 : Thermomechanical Analysis (TMA)
24 : Torsional Braid Analysis (TBA)
25 : Wetting Balance Method to Evaluate the Solderability of IC Devices
26 : X-Ray Laminography
27 : X-Ray Photoelectron Spectroscopy (XPS)
28 : X-Ray Radiographic Inspection
Index

 

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