IEC 62137-4:2014 :
IEC 62137-4:2014 : 1447833
IEC 62137-4:2014 :
Title: Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Pages: 85
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
Title: Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Pages: 85
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
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