IEC 60191-6-17:2011 :
IEC 60191-6-17:2011 : 1452749
IEC 60191-6-17:2011 :
Title: Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Pages: 53
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
Title: Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Pages: 53
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
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