IEC 60191-6-2:2001 : Title: Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages Pages: 10 Year: Publisher: International Electrotechnical Commission Availability: Within 1-2 working days
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