IEC 60191-6-22:2012 : Title: Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) Pages: 34 Year: Publisher: International Electrotechnical Commission Availability: Within 1-2 working days
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