IEC 60191-6-4:2003 :
IEC 60191-6-4:2003 : 1452757
IEC 60191-6-4:2003 :
Title: Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Pages: 16
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
Title: Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Pages: 16
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
Browse by Standards
