BS EN 60191-6-4:2003 :
BS EN 60191-6-4:2003 : 1386009
BS EN 60191-6-4:2003 :
Title: Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
Pages: 20
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
Title: Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
Pages: 20
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
Browse by Standards
