BS EN 60191-6-19:2010 :
BS EN 60191-6-19:2010 : 1386003
BS EN 60191-6-19:2010 :
Title: Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Pages: 18
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
Title: Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Pages: 18
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
Browse by Standards
