PD IEC/TS 62647-4:2018 :
PD IEC/TS 62647-4:2018 : 1361660
PD IEC/TS 62647-4:2018 :
Title: Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Ball grid array (BGA) re-balling
Pages: 44
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
Title: Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Ball grid array (BGA) re-balling
Pages: 44
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
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