IEC 62047-18:2013 :
IEC 62047-18:2013 : 1447664
IEC 62047-18:2013 :
Title: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Pages: 26
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
Title: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Pages: 26
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
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