IEC 62047-27:2017 :
IEC 62047-27:2017 : 1447672
IEC 62047-27:2017 :
Title: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
Pages: 16
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
Title: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
Pages: 16
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
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