IEC 62047-31:2019 :
IEC 62047-31:2019 : 1447677
IEC 62047-31:2019 :
Title: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Pages: 12
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
Title: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Pages: 12
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
Browse by Standards
