IEC 61189-2-807:2021 :
IEC 61189-2-807:2021 : 1451090
IEC 61189-2-807:2021 :
Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
Pages: 17
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
Pages: 17
Year:
Publisher: International Electrotechnical Commission
Availability: Within 1-2 working days IEC will directly send the standards to End-User after our confirmation.
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