IEC 61189-5-4:2015 : Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies Pages: 45 Year: Publisher: International Electrotechnical Commission Availability: Within 1-2 working days
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