PD IEC TR 61189-5-506:2019 :
PD IEC TR 61189-5-506:2019 : 1363974
PD IEC TR 61189-5-506:2019 :
Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
Pages: 26
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
Pages: 26
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
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