BS EN IEC 61189-5-601:2021 :
BS EN IEC 61189-5-601:2021 : 1381523
BS EN IEC 61189-5-601:2021 :
Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Pages: 46
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Pages: 46
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
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