PD IEC TR 63378-1:2021 :
PD IEC TR 63378-1:2021 : 1361124
PD IEC TR 63378-1:2021 :
Title: Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Pages: 24
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
Title: Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Pages: 24
Year:
Publisher: BSI
Availability: Within 1-2 working days BSI will directly send the standards to End-User after our confirmation.
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