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Jorg Franke

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Three-Dimensional Molded Interconnect Devices (3D-MID) : Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

Author: Jorg Franke
ISBN: 1569905517 / 9781569905517
Year: 2014
Availability: Out of Stock
Three-dimensional molded interconnect devices (MID) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on t...
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