International Electrotechnical Commission Standards
Total Record : 8295
IEC 60191-2:1966/AMD21:2020 :
Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: DimensionsAvailability: Within 1-2 working days
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IEC 60191-2:1966/AMD2:2001 :
Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60191-2:1966/AMD3:2001 :
Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60191-2:1966/AMD4:2001 :
Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60191-2:1966/AMD5:2002 :
Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60191-2:1966/AMD6:2002 :
Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 60191-2:1966/AMD7:2002 :
Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 60191-2:1966/AMD8:2003 :
Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 60191-2:1966/AMD9:2003 :
Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 10 |
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| List Price: Sfr 40 |
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| List Price: Sfr 75 |
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IEC 60191-2X:1999 :
Mechanical standardization of semiconductor devices - Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60191-2Y:2000 :
Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 60191-2Z:2000 :
Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: DimensionsAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60191-3:1999 :
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuitsAvailability: Within 1-2 working days
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| List Price: Sfr 290 |
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IEC 60191-4:2013+AMD1:2018 CSV :
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packagesAvailability: Within 1-2 working days
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| List Price: Sfr 295 |
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IEC 60191-4:2013/AMD1:2018 :
Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packagesAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60191-5:1997 :
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)Availability: Within 1-2 working days
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| List Price: Sfr 220 |
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IEC 60191-6-10:2003 :
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSONAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60191-6-12:2011 :
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)Availability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 60191-6-13:2016 :
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)Availability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 60191-6-16:2007 :
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGAAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 60191-6-17:2011 :
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)Availability: Within 1-2 working days
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| List Price: Sfr 185 |
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