International Electrotechnical Commission Standards
Total Record : 8295
IEC 61188-6-2:2021 :
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)Availability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 61188-6-4:2019 :
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern designAvailability: Within 1-2 working days
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| List Price: Sfr 260 |
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IEC 61188-7:2017 :
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library constructionAvailability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 61189-11:2013 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloysAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 61189-1:1997 :
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodologyAvailability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 61189-1:1997/AMD1:2001 :
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodologyAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 61189-2-501:2022 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materialsAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 61189-2-630:2018 :
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioningAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 61189-2-719:2016 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)Availability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 61189-2-721:2015 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonatorAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 61189-2-807:2021 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGAAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 61189-2:2006 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structuresAvailability: Within 1-2 working days
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| List Price: Sfr 330 |
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IEC 61189-3-719:2016 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cyclingAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 61189-3-913:2016 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDsAvailability: Within 1-2 working days
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| List Price: Sfr 185 |
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IEC 61189-3:2007 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)Availability: Within 1-2 working days
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| List Price: Sfr 360 |
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IEC 61189-5-1:2016 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assembliesAvailability: Within 1-2 working days
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| List Price: Sfr 185 |
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IEC 61189-5-2:2015 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assembliesAvailability: Within 1-2 working days
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| List Price: Sfr 260 |
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IEC 61189-5-301:2021 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particlesAvailability: Within 1-2 working days
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| List Price: Sfr 220 |
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IEC 61189-5-3:2015 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assembliesAvailability: Within 1-2 working days
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| List Price: Sfr 220 |
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IEC 61189-5-4:2015 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assembliesAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 61189-5-501:2021 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxesAvailability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 61189-5-502:2021 :
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assembliesAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 61189-5-503:2017 :
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boardsAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 61189-5-504:2020 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)Availability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 61189-5-601:2021 :
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boardsAvailability: Within 1-2 working days
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| List Price: Sfr 220 |
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