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Air Cooling Technology for Electronic Equipment

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Title: Air Cooling Technology for Electronic Equipment
Author: Sang Woo Lee, Sung Jin Kim
ISBN: 0849394473 / 9780849394478
Format: Hard Cover
Pages: 272
Publisher: CRC Press
Year: 1996
Availability: Out of Stock
     
 
  • Description
  • Contents

Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics.

Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling?

The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
 

Foreword
Preface

Chapter 1 : Geometric Optimization of Cooling Techniques
Chapter 2 : Entrance Design Correlations for Circuit Boards in Forced-Air Cooling
Chapter 3 : Forced Air Cooling of Low-Profile Package Arrays
Chapter 4 : Conjugate Heat Transfer in Forced Air Cooling of Electronic Components
Chapter 5 : Enhanced Air Cooling of Electronic Equipment
Chapter 6 : Limits of Air Cooling - A Methodical Approach

Index

 
 
 
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