CQI-17 : Special Process: Electronic Assembly Manufacturing-Soldering System Assessment (EAM-SSA), 3rd Edition (Hardcopy with Downloadable Assessment)

Title: CQI-17 : Special Process: Electronic Assembly Manufacturing-Soldering System Assessment (EAM-SSA), 3rd Edition (Hardcopy with Downloadable Assessment)
Author: AIAG
ISBN: 1605345547 / 9781605345543
Format: Soft Cover
Pages: 108
Publisher: AIAG
Year: 2026
Availability: In Stock

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CQI-17 provides a common framework for assessing soldering systems used in electronic assembly manufacturing across the automotive supply chain. Applicable to manufacturing, assembly, and soldering sites that process customer-specified production or service parts, it helps organizations and suppliers demonstrate their ability to consistently provide products that meet customer and applicable industry and regulatory requirements. It also supports customer satisfaction and continual improvement across electronic assembly operations.

The manual includes 15 process tables covering solder paste printing, component placement, reflow, automated and manual soldering, inspection, press-fit processes, contamination control, conformal coating, depaneling, testing, and rework. These tables address parameters that can affect electronic assembly quality and help manufacturers define and document appropriate control limits and assessment frequencies. By applying CQI-17, organizations can identify process weaknesses, strengthen process controls, and improve the consistency and quality of electronic assemblies.

Tab Article

About AIAG
Foreword

1 Introduction
1.1 General
1.2 Process Approach
1.3 Soldering System Assessment Goals
1.4 Assessment Process
1.5 Assessor Proficiency Requirements
1.6 Other Requirements

2 Scope
2.1 General
2.2 Application
2.3 Reference

3 Instructions for Completing Soldering System Assessment

3.1 Instructions for Completing The Cover Sheet
Cover Sheet Form

3.2 Instructions for Completing Sections 1 - 3
Section 1-Management Responsibility and Quality Planning
Section 2-Floor and Material Handling Responsibility
Section 3 - Equipment

3.3 Instructions for Completing Job Audit and Verifying Compliance to Process Table Items
Section 4 - Job Audit
Process Table A-Solder Paste Printing and Spi Inspection
Table A-1 - Process Parameters Guidelines - Solder Paste Printing
Process Table B-Surface Mount Component Placement
Table B-1-Process Parameters Guidelines - Surface Mount Component Placement
Process Table C-Reflow and Automated Inspection
Table C-1 - Process Parameters Guidelines - Reflow Oven
Process Table D-Adhesive Dispensing
Process Table E-Wave/Selective Solder
Table E-1 Process Parameters Guidelines - Wave/Selective Soldering
Process Table F - Automated (Robotic) Iron Soldering
Process Table F-1 - Manual Iron Soldering (Human)
Process Table G-Laser and Soft Beam Soldering
Table G-1- Process Parameters Guidelines - Laser & Soft Beam Soldering
Process Table H-Induction Soldering
Process Table I-Press Fit/Compliance Pin
Table I-1 Process Parameters Guidelines - Press Fit
Process Table J-Contamination Control
Table J-1 Process Parameters Guidelines - Contamination Control
Process Table K-Conformal Coating and Inspection
Table K-1 Process Parameters Guidelines - Conformal Coating
Process Table L-Pca Separation
Table L-1 Process Parameters Guidelines - Pca Separation
Process Table M-In-Circuit Testing
Process Table N-Functional Testing
Process Table O-Re-Work (Removal/Replacement and Touch-Up)

Glossary