Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today's cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications.
Contributors
Preface
Chapter 1 : Development and Fabrication of IC Chips
Chapter 2 : Plastics, Elastomers, and Composites
Chapter 3 : Ceramics and Glasses
Chapter 4 : Metals
Chapter 5 : Solder Technologies for Electronic Packaging and Assembly
Chapter 6 : Electroplating and Deposited Metallic Coatings
Chapter 7 : Printed Circuit Board Fabrication
Chapter 8 : Materials and Processes for Hybrid Microelectronics and Multichip Modules
Chapter 9 : Adhesives, Underfills, and Coatings in Electronics Assemblies
Chapter 10 : Thermal Management Materials and Systems
Index
