Welcome Guest
  |   0 items in your shopping cart
 

BROWSE BY STANDARDS

BROWSE BY CATEGORY

***
 
 
Join our mailing list to recieve newsletters
 

Green Electronics Manufacturing : Creating Environmental Sensible Products

Send to friend
 
Title: Green Electronics Manufacturing : Creating Environmental Sensible Products
Author: John X. Wang
ISBN: 1439826641 / 9781439826645
Format: Hard Cover
Pages: 344
Publisher: CRC Press
Year: 2013
Availability: In Stock
     
 
  • Description
  • Contents

Written for scientists and engineers involved in creating environmentally sensible products and technologies, Green Electronic Manufacturing offers an approach to designing electronics with special consideration for the environmental impacts of the product during its entire lifecycle, from raw material mining to end-of-life disposal or recycling. Examining the vast implications of eco-design on business and technology, this book goes beyond "green-practice" in the manufacturing process to discuss responsible electronics development as a management philosophy, design paradigm, and corporate culture toward an ultimately holistic environmental custodianship and commitment to society.

Preface
About the Author

Chapter 1 : Green Electronics Assembly : Strategic Industry Interconnection Direction
Chapter 2 : Tin Whiskers : New Challenge for Long-Term RoHS Reliability
Chapter 3 : Fatigue Characterization of Lead-Free Solders
Chapter 4 : Lead-Free Electronics Reliability : Finite Element Modeling
Chapter 5 : Lead-Free Electronics Reliability : Fatigue Life Model
Chapter 6 : Lead-Free Electronics Reliability : Higher Temperature
Chapter 7 : Fatigue Design of Lead-Free Electronics and Weibull Distribution
Chapter 8 : Enhancing Reliability of Ball Grid Array
Chapter 9 : Finite Element Modeling under High-Vibration and High-Temperature Environments
Chapter 10 : Probabilistic Modeling of the Elastic-Plastic Behavior of 63Sn-37Pb Solder Alloys
Chapter 11 : Flip-Chip Assembly for Lead-Free Electronics
Chapter 12 : Flip-Chip Bonding Techniques for Lead-Free Electronics
Chapter 13 : Flip-Chip Bonding of Opto-Electronics Integrated Circuits
Chapter 14 : Let's Package a Lead-Free Electronic Design

Index

 
 
 
About Us | Contact us
loading...
This page was created in 0.93489289283752 seconds