Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
Preface
Chapter 1 : An Overview of Hybrid Assemblies
Chapter 2 : Design And Development of Hybrid Assemblies
Chapter 3 : Ceramic Substrates
Chapter 4 : Thick-Film And Thin-Film Circuits
Chapter 5 : Screened Passive Components
Chapter 6 : Surface-Mount Components
Chapter 7 : Interconnection Technologies
Chapter 8 : Component Placement And Soldering
Chapter 9 : Testing Methods
Chapter 10 : Coating, Encapsulating And Marking
Chapter 11 : Installing and Using The Hybrid Assembly
Chapter 12 : Quality Assessment of Hybrid Assemblies
Chapter 13 : Multichip Modules
References
Index
