Microelectronics Failure Analysis Desk Reference, 7th Edition

The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples.

Topics include:

• Failure Analysis Process and Management - wafer, package, and board level failure analysis flow.
• Incoming Inspection Tools - optical, x-ray, and scanning acoustic microscopy.
• Fault Isolation - front and backside sample prepara­tion, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermog­raphy, laser voltage probing (LVP), photon emission, EOTPR/TDR/TDT, and current imaging.
• Device and Circuit Characterization - scanning electron microscopy (SEM)-based and atomic force microscopy (AFM)-based nanoprobing.
• FIB Technique and Circuit Edit -  FIB overview and advanced circuit edit for first silicon debug.
• Physical Analysis - deprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron micros­copy (TEM), and scanning probe microscopy.
• Memory FA - DRAM, semiconductor memory failure signature analysis.
• Special Applications - automotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics.
• Fundamental Topics - integrated circuit testing, analog design, reliability, quality, and training.

Seven new topics have been added and all themes covered in earlier editions are included in the Seventh Edition. Many previous articles have been updated.

Preface to the Seventh Edition

Section 1 : Failure Analysis Process and Management
Chapter 1 : Overview of Wafer-Level Electrical Failure Analysis Process for Accelerated Yield Engineering
Chapter 2 : Package Failure Analysis : Flow and Technique
Chapter 3 : Chip-Scale Packaging and Its Failure Analysis Challenges
Chapter 4 : Nondestructive Techniques for Advanced Board Level Failure Analysis
Chapter 5 : Failure Analysis Laboratory Management Principles and Practices

Section 2 : Incoming Inspection Tools
Chapter 6 : Optical Microscopy
Chapter 7 : X-Ray Imaging Tools for Electronic Device Failure Analysis
Chapter 8 : Acoustic Microscopy of Semiconductor Packages

Section 3 : Fault Isolation
Chapter 9 : Diagnosis of Scan Logic and Diagnosis Driven Failure Analysis
Chapter 10 : Magnetic Field Imaging for Electrical Fault Isolation
Chapter 11 : Fault Isolation Using Time Domain Reflectometry, Electro Optical Terahertz Pulse Reflectometry and Time Domain Transmissometry
Chapter 12 : Frontside Sample Preparation
Chapter 13 : Photon Emission in Silicon-Based Integrated Circuits
Chapter 14 : Physics of Laser-Based Failure Analysis
Chapter 15 : Localizing Defects with Thermal Detection Techniques
Chapter 16 : 3D Hot-Spot Localization by Lock-In Thermography
Chapter 17 : LADA and SDL : Powerful Techniques for Marginal Failures
Chapter 18 : Laser Voltage Probing of Integrated Circuits : Implementation and Impact
Chapter 19 : CAD Navigation Principles
Chapter 20 : Failure Localization with Active and Passive Voltage Contrast in FIB and SEM

Section 4 : Device and Circuit Characterization
Chapter 21 : Transistor Characterization : Physics and Instrumentation
Chapter 22 : The Fundamentals of Nanoprobe Analysis
Chapter 23 : Silicon Device Backside Deprocessing and Fault Isolation Techniques

Section 5 : FIB Technique and Circuit Edit
Chapter 24 : FIB Overview
Chapter 25 : Role of Advanced Circuit Edit for First Silicon Debug

Section 6 : Physical Analysis
Chapter 26 : Delayering Techniques : Dry/Wet Etch Deprocessing and Mechanical Top-Down Polishing
Chapter 27 : Cross-Sectioning : Mechanical Polishing, Ion Milling, and Focused Ion Beam
Chapter 28 : Cross-Sectioning : Scribing and Cleaving
Chapter 29 : Scanning Electron Microscopy
Chapter 30 : Energy Dispersive X-Ray Analysis
Chapter 31 : Surface Analysis and Material Characterization Techniques Used in Semiconductor Industry to Identify and Prevent Failures
Chapter 32 : Transmission Electron Microscopy
Chapter 33 : Scanning Probe Microscoopy for Nanoscale Semiconductor Devie Analysis

Section 7 : Memory Failure Analysis
Chapter 34 : DRAM Failure Analysis and Defect Localization Techniques
Chapter 35 : The Power of Semiconductor Memory Failure Signature Analysis

Section 8 : Special Applications of Failure Analysis
Chapter 36 : Early Life Failures in Automotive : Failure Analysis and Anamnesis, Root Causes and Preventive Risk Evaluation
Chapter 37 : Failure Analysis and Reliability of Optoelectronic Devices
Chapter 38 : Solar Photovoltaic Module Failure Analysis
Chapter 39 : 2.5D and 3D Packaging Failure Analysis Techniques
Chapter 40 : Failure Analysis Techniques and Methods for Microelectromechanical Systems
Chapter 41 : Failure Analysis of Capacitors and Inductors
Chapter 42 : Screening for Counterfeit Electronic Parts

Section 9 : Fundamentals Topics and Reference Information
Chapter 43 : Electronics and Failure Analysis
Chapter 44 : An Overview of Integrated Circuit Testing Methods
Chapter 45 : An Overview of Analog Design for Test and Diagnosis
Chapter 46 : Differentiating between EOS and ESD Failures for ICs
Chapter 47 : Reliability and Quality Basics for Failure Analysts
Chapter 48 : Training Needs for the Failure Analyst
Chapter 49 : Failure Analysis Terms and Definitions

Author Index
Subject Index