Tab Article

Preface to the Seventh Edition

Section 1 : Failure Analysis Process and Management
Chapter 1 : Overview of Wafer-Level Electrical Failure Analysis Process for Accelerated Yield Engineering
Chapter 2 : Package Failure Analysis : Flow and Technique
Chapter 3 : Chip-Scale Packaging and Its Failure Analysis Challenges
Chapter 4 : Nondestructive Techniques for Advanced Board Level Failure Analysis
Chapter 5 : Failure Analysis Laboratory Management Principles and Practices

Section 2 : Incoming Inspection Tools
Chapter 6 : Optical Microscopy
Chapter 7 : X-Ray Imaging Tools for Electronic Device Failure Analysis
Chapter 8 : Acoustic Microscopy of Semiconductor Packages

Section 3 : Fault Isolation
Chapter 9 : Diagnosis of Scan Logic and Diagnosis Driven Failure Analysis
Chapter 10 : Magnetic Field Imaging for Electrical Fault Isolation
Chapter 11 : Fault Isolation Using Time Domain Reflectometry, Electro Optical Terahertz Pulse Reflectometry and Time Domain Transmissometry
Chapter 12 : Frontside Sample Preparation
Chapter 13 : Photon Emission in Silicon-Based Integrated Circuits
Chapter 14 : Physics of Laser-Based Failure Analysis
Chapter 15 : Localizing Defects with Thermal Detection Techniques
Chapter 16 : 3D Hot-Spot Localization by Lock-In Thermography
Chapter 17 : LADA and SDL : Powerful Techniques for Marginal Failures
Chapter 18 : Laser Voltage Probing of Integrated Circuits : Implementation and Impact
Chapter 19 : CAD Navigation Principles
Chapter 20 : Failure Localization with Active and Passive Voltage Contrast in FIB and SEM

Section 4 : Device and Circuit Characterization
Chapter 21 : Transistor Characterization : Physics and Instrumentation
Chapter 22 : The Fundamentals of Nanoprobe Analysis
Chapter 23 : Silicon Device Backside Deprocessing and Fault Isolation Techniques

Section 5 : FIB Technique and Circuit Edit
Chapter 24 : FIB Overview
Chapter 25 : Role of Advanced Circuit Edit for First Silicon Debug

Section 6 : Physical Analysis
Chapter 26 : Delayering Techniques : Dry/Wet Etch Deprocessing and Mechanical Top-Down Polishing
Chapter 27 : Cross-Sectioning : Mechanical Polishing, Ion Milling, and Focused Ion Beam
Chapter 28 : Cross-Sectioning : Scribing and Cleaving
Chapter 29 : Scanning Electron Microscopy
Chapter 30 : Energy Dispersive X-Ray Analysis
Chapter 31 : Surface Analysis and Material Characterization Techniques Used in Semiconductor Industry to Identify and Prevent Failures
Chapter 32 : Transmission Electron Microscopy
Chapter 33 : Scanning Probe Microscoopy for Nanoscale Semiconductor Devie Analysis

Section 7 : Memory Failure Analysis
Chapter 34 : DRAM Failure Analysis and Defect Localization Techniques
Chapter 35 : The Power of Semiconductor Memory Failure Signature Analysis

Section 8 : Special Applications of Failure Analysis
Chapter 36 : Early Life Failures in Automotive : Failure Analysis and Anamnesis, Root Causes and Preventive Risk Evaluation
Chapter 37 : Failure Analysis and Reliability of Optoelectronic Devices
Chapter 38 : Solar Photovoltaic Module Failure Analysis
Chapter 39 : 2.5D and 3D Packaging Failure Analysis Techniques
Chapter 40 : Failure Analysis Techniques and Methods for Microelectromechanical Systems
Chapter 41 : Failure Analysis of Capacitors and Inductors
Chapter 42 : Screening for Counterfeit Electronic Parts

Section 9 : Fundamentals Topics and Reference Information
Chapter 43 : Electronics and Failure Analysis
Chapter 44 : An Overview of Integrated Circuit Testing Methods
Chapter 45 : An Overview of Analog Design for Test and Diagnosis
Chapter 46 : Differentiating between EOS and ESD Failures for ICs
Chapter 47 : Reliability and Quality Basics for Failure Analysts
Chapter 48 : Training Needs for the Failure Analyst
Chapter 49 : Failure Analysis Terms and Definitions

Author Index
Subject Index