International Electrotechnical Commission Standards
Total Record : 8295
IEC 60748-23-2:2002 :
Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special testsAvailability: Within 1-2 working days
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| List Price: Sfr 360 |
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IEC 60748-23-3:2002 :
Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and reportAvailability: Within 1-2 working days
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| List Price: Sfr 330 |
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IEC 60748-23-4:2002 :
Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specificationAvailability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 60748-23-5:2003 :
Semiconductor devices - Integrated circuits, Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approvalAvailability: Within 1-2 working days
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| List Price: Sfr 220 |
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IEC 60748-2:1997 :
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuitsAvailability: Within 1-2 working days
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| List Price: Sfr 405 |
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IEC 60748-3-1:1991 :
Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiersAvailability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 60748-3:1986 :
Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuitsAvailability: Within 1-2 working days
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| List Price: Sfr 380 |
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IEC 60748-3:1986/AMD1:1991 :
Amendment 1 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuitsAvailability: Within 1-2 working days
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| List Price: Sfr 220 |
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IEC 60748-3:1986/AMD2:1994 :
Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuitsAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60748-4-1:1993 :
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)Availability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 60748-4-2:1993 :
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)Availability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 60748-4-3:2006 :
Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)Availability: Within 1-2 working days
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| List Price: Sfr 220 |
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IEC 60748-4:1997 :
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuitsAvailability: Within 1-2 working days
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| List Price: Sfr 405 |
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IEC 60748-5:1997 :
Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuitsAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 60749-10:2022 :
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassemblyAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60749-11:2002 :
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath methodAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60749-12:2017 :
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequencyAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60749-13:2018 :
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphereAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60749-14:2003 :
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)Availability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60749-15:2020 :
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devicesAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 60749-16:2003 :
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)Availability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60749-17:2019 :
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiationAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 60749-18:2019 :
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)Availability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 60749-19:2003 :
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strengthAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60749-19:2003/AMD1:2010 :
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strengthAvailability: Within 1-2 working days
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| List Price: Sfr 10 |
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