International Electrotechnical Commission Standards
Total Record : 8295
IEC 60749-1:2002 :
Semiconductor devices - Mechanical and climatic test methods - Part 1: GeneralAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60749-20-1:2019 :
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heatAvailability: Within 1-2 working days
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| List Price: Sfr 260 |
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IEC 60749-20:2020 :
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heatAvailability: Within 1-2 working days
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| List Price: Sfr 185 |
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IEC 60749-21:2011 :
Semiconductor devices - Mechanical and climatic test methods - Part 21: SolderabilityAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 60749-22:2002 :
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strengthAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 60749-23:2004 :
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating lifeAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 60749-23:2004/AMD1:2011 :
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating lifeAvailability: Within 1-2 working days
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| List Price: Sfr 10 |
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IEC 60749-24:2004 :
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HASTAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 60749-25:2003 :
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cyclingAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60749-26:2018 :
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)Availability: Within 1-2 working days
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| List Price: Sfr 290 |
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IEC 60749-27:2006 :
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)Availability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60749-27:2006+AMD1:2012 CSV :
Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)Availability: Within 1-2 working days
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| List Price: Sfr 110 |
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IEC 60749-27:2006/AMD1:2012 :
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)Availability: Within 1-2 working days
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| List Price: Sfr 10 |
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IEC 60749-28:2022 :
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device levelAvailability: Within 1-2 working days
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| List Price: Sfr 260 |
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IEC 60749-29:2011 :
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up testAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 60749-2:2002 :
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressureAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60749-30:2020 :
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testingAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 60749-31:2002 :
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)Availability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60749-32:2002 :
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)Availability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 60749-32:2002/AMD1:2010 :
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)Availability: Within 1-2 working days
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| List Price: Sfr 10 |
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IEC 60749-33:2004 :
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclaveAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 60749-34:2010 :
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cyclingAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 60749-35:2006 :
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic componentsAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 60749-36:2003 :
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady stateAvailability: Within 1-2 working days
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| List Price: Sfr 10 |
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IEC 60749-37:2022 :
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometerAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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