Through-Silicon Vias for 3D Integration

A comprehensive guide to TSV and other enabling technologies for 3D integration

Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies : Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.

This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.

Coverage includes:

• Nanotechnology and 3D integration for the semiconductor industry
• TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing
• TSVs : mechanical, thermal, and electrical behaviors
• Thin-wafer strength measurement
• Wafer thinning and thin-wafer handling
• Microbumping, assembly, and reliability
• Microbump electromigration
• Transient liquid-phase bonding : C2C, C2W, and W2W
• 2.5D IC integration with interposers
• 3D IC integration with interposers
• Thermal management of 3D IC integration
• 3D IC packaging

Preface

Chapter 1 : Introduction to Microelectronics and Nanoelectronics
Chapter 2 : Origin and Evolution of 3D Integration
Chapter 3 : Trends and Outlook of 3D IC Packaging
Chapter 4 : Through-Silicon Vias (TSVs) Technology
Chapter 5 : Challenges and Outlook of 3D Si Integration
Chapter 6 : Challenges and Outlook of 3D IC Integration
Chapter 7 : Thin-Wafer Strength Measurements
Chapter 8 : Thin-Wafer Handling
Chapter 9 : Low-Cost Microbumping
Chapter 10 : C2C and C2W Bonding with Microbumps
Chapter 11 : Low Temperature Bonding
Chapter 12 : Electromigration of Microbump Assemblies
Chapter 13 : Memory Stacking Methods
Chapter 14 : Active TSV Interposers
Chapter 15 : Passive TSV Interposers
Chapter 16 : Thermal Management of 3D IC Integration
Chapter 17 : 3D IC and CIS Integration
Chapter 18 : 3D IC and MEMS Integration
Chapter 19 : 3D IC and LED Integration
Chapter 20 : Embedded 3D Hybrid IC and Opto-electronic Integration in Organic Substrates

Index