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John H. Lau

Total Book : 1

Through-Silicon Vias for 3D Integration
Author: John H. Lau
ISBN: 0071785140 / 9780071785143
Year: 2012
Availability: 45-60 days

A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D...

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List Price: $ 179

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