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International Electrotechnical Commission Standards
Total Record : 8295
IEC 62047-2:2006 :
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
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IEC 62047-30:2017 :
Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
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IEC 62047-31:2019 :
Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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IEC 62047-32:2019 :
Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
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IEC 62047-33:2019 :
Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
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IEC 62047-34:2019 :
Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
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IEC 62047-35:2019 :
Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
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IEC 62047-36:2019 :
Semiconductor devices - Micro-electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
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IEC 62047-37:2020 :
Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
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IEC 62047-38:2021 :
Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
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IEC 62047-3:2006 :
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
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20
IEC 62047-40:2021 :
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
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40
IEC 62047-41:2021 :
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
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220
IEC 62047-42:2022 :
Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
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IEC 62047-4:2008 :
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
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115
IEC 62047-5:2011 :
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
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220
IEC 62047-6:2009 :
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
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75
IEC 62047-7:2011 :
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
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185
IEC 62047-8:2011 :
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
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115
IEC 62047-9:2011 :
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
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150
IEC 62052-11:2020 :
Electricity metering equipment - General requirements, tests and test conditions - Part 11: Metering equipment
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360
IEC 62052-21:2004 :
Electricity metering equipment (a.c.) - General requirements, tests and test conditions - Part 21: Tariff and load control equipment
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260
IEC 62052-21:2004/AMD1:2016 :
Amendment 1 - Electricity metering equipment (a.c.) - General requirements, tests and test conditions - Part 21: Tariff and load control equipment
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IEC 62052-31:2015 :
Electricity metering equipment (AC) - General requirements, tests and test conditions - Part 31: Product safety requirements and tests
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405
IEC 62052-41:2022 :
Electricity metering equipment - General requirements, tests and test conditions - Part 41: Energy registration methods and requirements for multi-energy and multi-rate meters
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