International Electrotechnical Commission Standards
Total Record : 8295
IEC 62040-4:2013 :
Uninterruptible power systems (UPS) - Part 4: Environmental aspects - Requirements and reportingAvailability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 62040-5-3:2016 :
Uninterruptible power systems (UPS) - Part 5-3: DC output UPS - Performance and test requirementsAvailability: Within 1-2 working days
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| List Price: Sfr 330 |
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IEC 62041:2017 :
Transformers, power supplies, reactors and similar products - EMC requirementsAvailability: Within 1-2 working days
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| List Price: Sfr 185 |
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IEC 62044-1:2002 :
Cores made of soft magnetic materials - Measuring methods - Part 1: Generic specificationAvailability: Within 1-2 working days
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| List Price: Sfr 20 |
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IEC 62044-2:2005 :
Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation levelAvailability: Within 1-2 working days
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| List Price: Sfr 220 |
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IEC 62044-3:2000 :
Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation levelAvailability: Within 1-2 working days
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| List Price: Sfr 220 |
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IEC 62046:2018 :
Safety of machinery - Application of protective equipment to detect the presence of personsAvailability: Within 1-2 working days
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| List Price: Sfr 360 |
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IEC 62047-10:2011 :
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materialsAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 62047-11:2013 :
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systemsAvailability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 62047-12:2011 :
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structuresAvailability: Within 1-2 working days
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| List Price: Sfr 185 |
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IEC 62047-13:2012 :
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structuresAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 62047-14:2012 :
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materialsAvailability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 62047-16:2015 :
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methodsAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 62047-17:2015 :
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin filmsAvailability: Within 1-2 working days
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| List Price: Sfr 185 |
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IEC 62047-18:2013 :
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materialsAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 62047-19:2013 :
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compassesAvailability: Within 1-2 working days
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| List Price: Sfr 185 |
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IEC 62047-1:2016 :
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitionsAvailability: Within 1-2 working days
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| List Price: Sfr 220 |
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IEC 62047-20:2014 :
Semiconductor devices - Micro-electromechanical devices - Part 20: GyroscopesAvailability: Within 1-2 working days
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| List Price: Sfr 290 |
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IEC 62047-21:2014 :
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materialsAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 62047-22:2014 :
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substratesAvailability: Within 1-2 working days
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| List Price: Sfr 40 |
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IEC 62047-25:2016 :
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding areaAvailability: Within 1-2 working days
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| List Price: Sfr 150 |
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IEC 62047-26:2016 :
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structuresAvailability: Within 1-2 working days
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| List Price: Sfr 185 |
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IEC 62047-27:2017 :
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)Availability: Within 1-2 working days
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| List Price: Sfr 75 |
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IEC 62047-28:2017 :
Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devicesAvailability: Within 1-2 working days
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| List Price: Sfr 115 |
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IEC 62047-29:2017 :
Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperatureAvailability: Within 1-2 working days
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| List Price: Sfr 75 |
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